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nanoFIS 2017 — Functional Integrated nanoSystems
22 Nov 2017 - 24 Nov 2017 • Graz, Austria
nanoFIS 2017 intends to contribute to challenges and topics of European Micro- & Nanoelectronics and to increase visibility in particular in the More-Than-Moore domain. The nanoFIS 2017 conference focuses on implementation of Key Enabling Technologies for Novel Device Development and High Performance System Integration.
Margit Malatschnig;     Phone: [+4369919215844];     Email:
ADVANCED FUNCTIONAL MATERIALS, Nanowires, Carbon Nanotubes, Nanorods, Quantum Dots & Nanoparticles, 2D-Materials, Graphene, Electroceramic and Metal Oxide Materials, Organic and flexible Electronic Materials, Photonic Materials, NAODEVICES, NANOSYStems, Nanowires, Carbon Nanotubes and Nanoparticles based Devices, Nanosensors and Quantum Sensors, 2D-Material based Devices, Chemical and Particle Nanosensors, Nanoresonators & Nanogenerators, Nano Energy Harvesting & Energy Storage, Nanophotonic Devices, MEMS & NEMS Devices, Nanodevice Architecture & Design, SYSTEM INTEGRATION & PACKAGING, Heterogeneous Integration, TSV Technologies and TVS based Devices, 3D-Integration, 3D SoC and SiP Solutions, Advanced Wafer Bonding Technologies, High Performance Integration, NANOANALYTICS, RELIABILITY, Reliability Issues of Nanomaterials, Nanodevices and Nanosystems, Nanoanalytical Methods and Quantum Metrology, Material Properties Characterization in nm- and µm-Scale, Advanced Material Modelling and Simulation, Statistical Models for short, mid and long term Reliability Prediction, MEMS, NEMS Reliability Issues, SMART MANUFACTURING PROCESSES, Nanomaterials Fabrication Technologies, Synthesis of Quantum Dots, Thermal Oxidation, New Patterning Approaches, Thin Film Deposition, ALD, Spray Pyrolysis, Ink-Jetting, Print Transfer, Processing of Nanomaterials on CMOS devices, Back-end Equipment for 3D-Integration & Packaging
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Last updated: 23 March 2017