Meetings/Workshops on Condensed Matter Physics: Semiconductors in Japan

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Australia (1) - Belgium (2) - China (1) - Japan (4) - Poland (1) - Russia (1) - Switzerland (2) - Taiwan (1) - United Kingdom (2) - United States (18) - ALL COUNTRIES (33)

1
ISPlasma2019 — 11th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials
17 Mar 2019 - 21 Mar 2019 • Nagoya, Japan
Abstract:
ISPlasma/IC-PLANTS is a specialized international symposium that brings together about 500 world-leading scientists and engineers in Nagoya, Japan to discuss latest researches in the fields of advanced plasma science, its applications for the processing and manufacturing of nitride semiconductors and nanomaterials, as well as new ecosystems for technology transfers.
Event listing ID:
1169649
2
IC-PLANTS2019 — 12th International Conference on Plasma-Nano Technology & Science
17 Mar 2019 - 21 Mar 2019 • Nagoya, Japan
Abstract:
ISPlasma/IC-PLANTS is a specialized international symposium that brings together about 500 world-leading scientists and engineers in Nagoya, Japan to discuss latest researches in the fields of advanced plasma science, its applications for the processing and manufacturing of nitride semiconductors and nanomaterials, as well as new ecosystems for technology transfers.
Event listing ID:
1169648
3
ECI — INTERNATIONAL CONFERENCE ON SEMICONDUCTOR TECHNOLOGY FOR ULTRA LARGE SCALE INTEGRATION CIRCUITS AND THIN FILM TRANSISTORS VII (ULSIC VS TFT 7)
19 May 2019 - 23 May 2019 • Kyoto, Japan
Organizer:
Engineering Conferences International (ECI)
Abstract:
The 7th ULSIC vs. TFT conference continues the tradition of the previous six successful conferences held in Barga, Italy (2007), Xi’An, China (2009), Hong Kong, China (2011), Grenoble, France (2013), Lake Tahoe, California, USA (2015) and Hernstein, Austria (2017) in providing a forum to discuss the latest developments in semiconductor technology, ranging from nanoscience to giga-scale integration.

This is the only conference bringing together experts from the two most popular semiconductor technologies – ULSICs and TFTs – to discuss ideas and exchange opinions on future challenges cohesively. Both technologies are based on the same principles and face common challenges in devices, materials, fabrication processes, reliability, and applications.

The goal of this conference is to exchange state-of-the-art information and thoughts among those involved in research and development. Invited speakers include distinguished researchers, engineers, professors, and national academy members from US, Europe and Asia. A portion of the oral and poster presentations are reserved for junior researchers.

Contact:
Phone: [2125146760];     Email: info@engconfintl.org
Topics:
ULSIC TFT science technology Devices Physics Modeling Reliability Materials of Semiconductors Dielectrics developments Interconnects Advanced Fabrication Processes
Event listing ID:
1195708
Related subject(s):
4
LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration
21 May 2019 - 25 May 2019 • Kanazawa, Ishikawa-prefecture, Japan
Abstract:
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems.
Event listing ID:
1190571
Related subject(s):

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AIP Conference Proceedings
Last updated: 08 February 2019