Plastic Processing, Composite Materials in Romania
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SIITME — 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging
25 Oct 2018 - 28 Oct 2018 • Iasi, Romania
The Primary objective of the Conference is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities. It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings. SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days.
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Last updated: 01 April 2018