Konferenzen zum Thema Elektronik in China

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ICRMS — 2018 12th International Conference on Reliability, Maintainability, and Safety
17. Okt 2018 - 19. Okt 2018 • Shanghai, China
The conference will bring together the expertise of the academic, technical and management communities for facilitating cross-fertilization to share in ”Reliability, Maintainability & Safety for Intelligent Manufacturing” in different areas of research and application, such as instrumentation, automation control, mechanical engineering, aviation, aerospace, automotive, transportation, electric power, petrochemical, civil engineering, electronic and electrical engineering, communication, computer network etc.
Verwandte Fachgebiete:
ICCP — 2018 International Conference on Communication Problem-Solving
19. Okt 2018 - 21. Okt 2018 • Wuhan, China
RF Circuit and Subsystem Small Antenna, Planar/reflect antenna array, MCM, LCP/LTCC technologies, System on package, Subsystem integration, Passive device/circuits design and modeling, Active device/circuits design and modeling, RFIC & MMIC based on GaN/SiGe/RFCMOS, PLL technologies, High speed/high bits ADC/DAC, broadband/high power amplifier, etc. Signal Process Technology Channel modeling, Signal Processing technologies for link/access Communication Systems, Signal Processing for Radar and sensor Systems, Compressive Sensing, Sparse Signal Processing, Waveform Diversity and Design, Adaptive Antennas and Beamforming, MIMO or SAR imaging signal processing, 2D/3D image/video signal processing Networks Ad hoc, Body Area, Sensor and Mesh Networks, Wireless Multimedia Networks, Internet of Things, Network Measurement and Monitoring Techniques, Multimode Wireless Networks, Next-generation Networking Architectures, Network Design, Planning and Economics, Network Protocols, Applications & S
ICSICT — 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology
31. Okt 2018 - 03. Nov 2018 • Qingdao, China
Process & Device Technologies 1. Channel Engineering 2. High-k/Metal gate Technology 3. Advanced Source/Drain Technology 4. Interconnect Technology 5. Advanced 3D Integration 6. Novel Process Technologies 7. Ultra-Thin Body Transistors and Device Variability 8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs 11. CNT, MTJ Devices and Nanowire Photodiodes 12. Low- Power and Steep Slope Switching Devices 13. Graphene Devices 14. Advanced Technologies for Ge MOSFETs 15. Organic semiconductor devices and technologies 16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability 19. Flash Memory 20. IT Magnetic RAM 21. Resistive RAM
AEATC2018 — Automotive E/E Architecture Technology China Conference 2018
01. Nov 2018 - 02. Nov 2018 • Shanghai, China
The upcoming “Automotive E/E Architecture Technology China Conference 2018” to be held on the 1st - 2nd Nov. 2018. in Shanghai will invite 200+ worldwide leading Automotive OEMs, Tier 1s, semiconductors, Automotive engineering companies, software, testing, designing companies, and research institutes to discuss the evolution & revolution of automotive E/E architectures and how the industry leading companies envision the technology in the future. This conference will give you solutions on the bottlenecks for current E/E architectures and drivers for their evolution, and provide you with a precious platform to network and buildup profitable and sustainable partnership and achieve future success in the world’s largest automotive market.
Klaus Qian;     Tel.: [+8615021948198];     Email: klaus.qian@grccinc.com
• Developing Trends of E/E Architecture • CAN-BUS Technologies (such as. BRR-based Ethernet Technology and relevant testing technologies; (Consistency, negative testing and stress testing ) • Software platform technology(Including In-vehicle OS, such as ROS) • Hardware Technologies (HSM ‘Cyber Security’and lock step technology (Functional Safety) new chips technologies etc. • How to build a standardized hardware platform • Discuss the flexiable, extendable and reconfigurable modern E/E architecture • To explore how to use the powerful central processor to meet the new requirements of data processing with the help of "cloud" broadband data communication • Key Technologies for Tomorrow's E/E Architecture: including advance gateways, connected vehicles, domain ECUs, new in-vehicle communication networks and new software approaches • Development prospects of architecture model with reliable, real-time wireless connectivity-”Cloud” • Development of new E/E Architecture for intelligent electric vehicle • Master the information security system and basic communication protocol standard of intelligent electric vehicle • Understand the solid E/E Architecture of a self driving car • E/E Architecture testing and validation......
PEAC — 2018 IEEE International Power Electronics and Application Conference and Exposition
04. Nov 2018 - 07. Nov 2018 • Shenzhen, China
Power Electronics Application Conference and Exposition (PEAC) is an international conference for presentation and discussion of the state of art in power electronics and energy conversion, mainly in power supply and related areas. The world's industry, research, and academia are cordially invited to participate in an array of presentations, tutorials, Exhibitions and social activities for the advancement of science, technology, engineering education, and fellowship. Technical interests of the conference are included but not limited to: Switching Power Supply; Inverter and UPS; Power Devices and System Integrations; High Frequency Magnetic and Integrated Magnetic; Modeling, control, Simulation, EMI and Reliability; Conversion Technologies for Renewable Energy and Energy Saving; Power Electronics Applied to Transmission and Distribution Systems; Power Electronics Applied to Electric Vehicles and Railway Systems; Lighting electronics.
Verwandte Fachgebiete:
APMRC 2018 — Asia-Pacific Magnetic Recording Conference 2018
09. Nov 2018 - 15. Nov 2018 • Shanghai, China
Verwandte Fachgebiete:
DSP — 2018 IEEE 23rd International Conference on Digital Signal Processing
19. Nov 2018 - 21. Nov 2018 • Shanghai, China
DSP addresses the theory and application of filtering, coding, transmitting, estimating, detecting, analyzing, recognizing, synthesizing, recording, and reproducing signals by means of digital devices or techniques. The term "signal" includes audio, video, speech, image, communication, geophysical, sonar, radar, medical, musical, and other signals.
GSEF — Global Semiconductor and Electronics Forum 2019
13. Mär 2019 - 15. Mär 2019 • Shanghai, China
Providing the only platform which supports progression of the entire end-to-end value chain, GSEF brings together representatives from chip developers to final application creators to network, explore current and future trends, find solutions to business-hindering challenges, and in some instances, do business on site.
CSTIC — China Semiconductor Technology International Conference
20. Mär 2019 - 22. Mär 2019 • Shanghai, China
ISPSD — 31st IEEE International Symposium on Power Semiconductor Devices and ICs
19. Mai 2019 - 23. Mai 2019 • Shanghai, China
ISPSD is the premier forum for technical discussions in all areas of power semiconductor devices, power integrated circuits, their hybrid technologies and applications. The conference rotates on a four-year cycle across the world.

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Stand vom 11. September 2018