Konferenzen zum Thema Elektronik in den Vereinigten Staaten (USA)

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1
VLSIC — IEEE Symposium on VLSI Circuits
18. Jun 2018 - 22. Jun 2018 • Honolulu, Vereinigte Staaten
Eintrags-ID:
985724
Verwandte Fachgebiete:
2
IWLS — 2018 27th International Workshop on Logic and Synthesis
23. Jun 2018 - 24. Jun 2018 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The International Workshop on Logic and Synthesis is the premier forum for research in synthesis, optimization, and verification of integrated circuits and systems. Research on logic synthesis for emerging technologies and for novel computing platforms, such as nanoscale systems and biological systems, is also strongly encouraged. The workshop encourages early dissemination of ideas and results. The workshop accepts complete papers highlighting important new problems in the early stages of development, without providing complete solutions. The emphasis is on novelty and intellectual rigor.
Eintrags-ID:
1005131
3
3D-PEIM — 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing
25. Jun 2018 - 27. Jun 2018 • College Park, MD, Vereinigte Staaten
Zusammenfassung:
Advancements in 3D integrated, embedded, and additively manufactured packaging for smaller, lighter, more efficient, and sustainable power electronic products.
Eintrags-ID:
971196
Verwandte Fachgebiete:
4
PEDG — 2018 9th IEEE International Symposium on Power Electronics for Distributed Generation Systems
25. Jun 2018 - 28. Jun 2018 • Charlotte, NC, Vereinigte Staaten
Zusammenfassung:
The symposium, sponsored by IEEE Power Electronics Society and organized by the PELS Technical Committee on Sustainable Energy Systems will provide a venue for power electronics experts to present the results of their cutting-edge research and learn what is in store for the future of the electric power grid. PEDG 2018 will feature keynote speeches, tutorials, and regular technical sessions on theory, analysis, design and development, testing, deployment and impact of power electronics for distributed generation, energy storage, and sustainable energy resources.
Eintrags-ID:
921269
5
ISLPED — ACM/IEEE International Symposium on Low Power Electronics and Design
23. Jul 2018 - 25. Jul 2018 • Washington, Vereinigte Staaten
Eintrags-ID:
1016939
6
Gordon Research Seminar — Defects in Semiconductors
18. Aug 2018 - 19. Aug 2018 • New London, NH, Vereinigte Staaten
Zusammenfassung:
This meeting will focus on identifying, understanding, and then controlling defects in order to use their properties to engineer new semiconductor materials and devices. The role of defects in electronic and optoelectronic devices, quantum information and metrology, and photocatalysis will be explored.
Eintrags-ID:
953654
7
HCS — 2018 IEEE Hot Chips 30 Symposium
19. Aug 2018 - 21. Aug 2018 • Cupertino, CA, Vereinigte Staaten
Zusammenfassung:
Computing devices such as microprocessors, GPUs, DSPs, ASSPs, NNAs and related technologies such as memories, interconnects.
Eintrags-ID:
1005012
Verwandte Fachgebiete:
8
Gordon Research Conference — Defects in Semiconductors
19. Aug 2018 - 24. Aug 2018 • New London, NH, Vereinigte Staaten
Zusammenfassung:
This Gordon Research Conference is a unique biannual opportunity to discuss defects across all semiconductor materials and applications in an off-the-record format. By blending lecture hall discourse and social gatherings, young scientists and experienced professionals will learn the latest concerns and advances in semiconductors while enjoying the conference-friendly facilities and relaxing atmosphere of Colby-Sawyer College. The meeting will address the theoretical basics as well as the characterization and utility of point, line and extended defects in a broad range of topical materials.
Eintrags-ID:
953600
9
Quantum Computing Materials Challenges
27. Aug 2018 - 29. Aug 2018 • Institute for Pure and Applied Mathematics (IPAM), Vereinigte Staaten
Zusammenfassung:
Materials that behave as quantum bits (qubits) will be the quantum chips that underlie a future quantum economy. Currently, a variety of materials have been proposed as qubit materials ranging from topological phases of matter to nitrogen-vacancy centers in diamond. Advancing the understanding and prediction of qubit materials is essential to the second quantum revolution centering on quantum computing. This three-day workshop will explore the mathematical modeling of materials for quantum computing by bringing together people from the materials modeling and simulation and quantum computing communities. The goal is to identify the grand challenges and propose possible solutions in the modeling and simulation of qubit materials and quantum devices for the engineering of a large-scale useful quantum computer.
Eintrags-ID:
1017820
10
SOCC — 2018 31st IEEE International System-on-Chip Conference
04. Sep 2018 - 07. Sep 2018 • Arlington, VA, Vereinigte Staaten
Eintrags-ID:
983358
Verwandte Fachgebiete:
11
ECCE — 2018 IEEE Energy Conversion Congress and Exposition
23. Sep 2018 - 27. Sep 2018 • Portland, OR, Vereinigte Staaten
Zusammenfassung:
The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.
Eintrags-ID:
838304
Verwandte Fachgebiete:
12
IIRW — 2018 International Integrated Reliability Workshop
07. Okt 2018 - 11. Okt 2018 • South Lake Tahoe, CA, Vereinigte Staaten
Zusammenfassung:
The IEEE International Integrated Reliability Workshop (IIRW) focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Topics include: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, MEMS and sensor reliability, designing-in reliability (products, circuits, systems, processes), customer product reliability requirements / manufacturer reliability tasks, wafer level reliability tests (test approaches and reliability test structures), reliability modeling and simulation, optoelectronics, and single event upsets.
Eintrags-ID:
1045149
13
DFT — 2018 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
08. Okt 2018 - 10. Okt 2018 • Chicago, IL, Vereinigte Staaten
Zusammenfassung:
DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in VLSI and nanotechnology systems inclusive of emerging technologies. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation are of interest.
Eintrags-ID:
1004830
Verwandte Fachgebiete:
14
BCICTS — 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium
14. Okt 2018 - 17. Okt 2018 • San Diego, Kalifornien, Vereinigte Staaten
Zusammenfassung:
The IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) is the forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology. Coverage includes all aspects of the technology, from materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications. A wide range of integrated circuit technologies are covered including bipolar, BiCMOS, SiGe, GaAs, GaN, InP, SiC, and CMOS. The latest results in wireless, analog, RF, microwave, high-speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced.
Eintrags-ID:
934369
15
EPEPS — 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
14. Okt 2018 - 17. Okt 2018 • San Jose, Kalifornien, Vereinigte Staaten
Zusammenfassung:
A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm-wave applications.
Eintrags-ID:
986196
Verwandte Fachgebiete:
16
S3S — 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
15. Okt 2018 - 18. Okt 2018 • Burlingame, CA, Vereinigte Staaten
Zusammenfassung:
Our contributed papers and invited talks are focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration. These 3 technologies will play a major role in tomorrow’s industry as they enable application-tailored and Energy / Cost efficient circuit designs.
Eintrags-ID:
1044618
17
IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
21. Okt 2018 - 23. Okt 2018 • Washington, DC, Vereinigte Staaten
Zusammenfassung:
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
Eintrags-ID:
1045065
18
ITC — 2018 IEEE International Test Conference
30. Okt 2018 - 03. Nov 2018 • Phoenix, AZ, Vereinigte Staaten
Zusammenfassung:
International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification and validation, test (DFT, ATPG, and BIST), diagnosis, failure analysis and back to process, yield, reliability and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
Eintrags-ID:
874190
19
WiPDA — 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications
31. Okt 2018 - 02. Nov 2018 • Atlanta, GA, Vereinigte Staaten
Zusammenfassung:
The Workshop on Wide Bandgap Power Devices and Applications (WiPDA) provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, development experience, and application knowledge.
Eintrags-ID:
1044715
20
WiSEE — 2018 6th IEEE International Conference on Wireless for Space and Extreme Environments
11. Dez 2018 - 13. Dez 2018 • Huntsville, AL, Vereinigte Staaten
Zusammenfassung:
This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments.
Eintrags-ID:
983227
Verwandte Fachgebiete:
21
RWS — 2019 IEEE Radio and Wireless Symposium
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
This is a conference with a focus on wireless components, applications, and systems that impact both our current and future life style. The conference's main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today's design compromises can trigger tomorrow's advanced technologies. Where dreams can become a reality. RWS is the cornerstone conference for Radio Wireless Week.
Eintrags-ID:
934253
22
PAWR — 2019 IEEE Topical Conference on RF/Microwave Power Amplifiers for Radio and Wireless Applications
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
Topics in RF/microwave power amplifiers
Eintrags-ID:
934307
23
SiRF — 2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.
Eintrags-ID:
934261
24
ISSCC — 2019 IEEE International Solid- State Circuits Conference
02. Feb 2019 - 06. Feb 2019 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
Eintrags-ID:
573546
25
DAC — 56th 2019 ACM/EDAC/IEEE Design Automation Conference
02. Jun 2019 - 06. Jun 2019 • Las Vegas, NV, Vereinigte Staaten
Zusammenfassung:
EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.
Eintrags-ID:
856520
26
NSREC — 2019 IEEE Nuclear and Space Radiation Effects Conference
08. Jul 2019 - 12. Jul 2019 • San Antonio, TX, Vereinigte Staaten
Zusammenfassung:
Conference offers a one day "Short Course" and 3.5 days of Tehchnical sessions consisting of 8-10 session of contributed papers. The material presented is completely related to the radiation environment and its impact on electrical components and materials
Eintrags-ID:
907089
27
ISVLSI — 2019 IEEE Computer Society Annual Symposium on VLSI
15. Jul 2019 - 17. Jul 2019 • North Miami, FL, Vereinigte Staaten
Zusammenfassung:
This Symposium explores emerging trends and novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies. Future design methodologies as well as new CAD tools to support them will also be the key topics. ISVLSI 2019 highlights a special theme of Neuromoprhic Computing. Over almost two decades the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI.
Eintrags-ID:
1004655
Verwandte Fachgebiete:
28
PAST — 2019 IEEE International Symposium on Phased Array System & Technology
15. Okt 2019 - 18. Okt 2019 • Waltham, MA, Vereinigte Staaten
Zusammenfassung:
Phased array systems have made major steps forward with the development of many major radar and communications systems. Due to many recent advances, including MMIC, photonics, and digital beamforming, phased array systems and technology continue to progress rapidly. Current and future developments of ground -based, sea-based, airborne, and space -based phased array radar, communications, and other electronic systems will be discussed at this international symposium.
Eintrags-ID:
950536
29
ITC — 2019 IEEE International Test Conference
09. Nov 2019 - 15. Nov 2019 • Washington, DC, Vereinigte Staaten
Zusammenfassung:
International Test Conference, the cornerstone of TestWeek events, is the premier conference dedicated to the electronic test of devices, boards and systems – covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment designers, and test engineers
Eintrags-ID:
1004647
30
IEDM — 2019 IEEE International Electron Devices Meeting
09. Dez 2019 - 11. Dez 2019 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
Eintrags-ID:
520725
31
ISSCC — 2020 IEEE International Solid- State Circuits Conference
02. Feb 2020 - 06. Feb 2020 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
Eintrags-ID:
573490
32
ECTC — 2020 IEEE 70th Electronic Components and Technology Conference
26. Mai 2020 - 29. Mai 2020 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Eintrags-ID:
572793
33
DAC — 2020 57th ACM/EDAC/IEEE Design Automation Conference
01. Jun 2020 - 05. Jun 2020 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572724
34
EMCSI — 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity
27. Jul 2020 - 31. Jul 2020 • Reno, NV, Vereinigte Staaten
Zusammenfassung:
This symposium pertains to the field of electromagnetic compatibility.
Eintrags-ID:
976607
35
ECTC — 2021 IEEE 71st Electronic Components and Technologies Conference
01. Jun 2021 - 04. Jun 2021 • San Diego, Kalifornien, Vereinigte Staaten
Zusammenfassung:
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Eintrags-ID:
572847
36
DAC — 2021 58th ACM/EDAC/IEEE Design Automation Conference
07. Jun 2021 - 11. Jun 2021 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572723
37
IEDM — 2021 IEEE International Electron Devices Meeting
13. Dez 2021 - 15. Dez 2021 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
Eintrags-ID:
520713
38
DAC — 2022 59th ACM/EDAC/IEEE Design Automation Conference
06. Jun 2022 - 10. Jun 2022 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572722

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Stand vom 01. April 2018