Konferenzen zum Thema Elektronik in den Vereinigten Staaten (USA)

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1
ECCE — 2018 IEEE Energy Conversion Congress and Exposition
23. Sep 2018 - 27. Sep 2018 • Portland, OR, Vereinigte Staaten
Zusammenfassung:
The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.
Eintrags-ID:
838348
Verwandte Fachgebiete:
2
IIRW — 2018 International Integrated Reliability Workshop
07. Okt 2018 - 11. Okt 2018 • South Lake Tahoe, CA, Vereinigte Staaten
Zusammenfassung:
The IEEE International Integrated Reliability Workshop (IIRW) focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Topics include: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, MEMS and sensor reliability, designing-in reliability (products, circuits, systems, processes), customer product reliability requirements / manufacturer reliability tasks, wafer level reliability tests (test approaches and reliability test structures), reliability modeling and simulation, optoelectronics, and single event upsets.
Eintrags-ID:
1045083
3
DFT — 2018 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
08. Okt 2018 - 10. Okt 2018 • Chicago, IL, Vereinigte Staaten
Zusammenfassung:
DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in VLSI and nanotechnology systems inclusive of emerging technologies. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation are of interest.
Eintrags-ID:
1004852
Verwandte Fachgebiete:
4
BCICTS — 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium
14. Okt 2018 - 17. Okt 2018 • San Diego, Kalifornien, Vereinigte Staaten
Zusammenfassung:
The IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) is the forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology. Coverage includes all aspects of the technology, from materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications. A wide range of integrated circuit technologies are covered including bipolar, BiCMOS, SiGe, GaAs, GaN, InP, SiC, and CMOS. The latest results in wireless, analog, RF, microwave, high-speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced.
Eintrags-ID:
934281
5
EPEPS — 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
14. Okt 2018 - 17. Okt 2018 • San Jose, Kalifornien, Vereinigte Staaten
Zusammenfassung:
A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm-wave applications.
Eintrags-ID:
986130
Verwandte Fachgebiete:
6
S3S — 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
15. Okt 2018 - 18. Okt 2018 • Burlingame, CA, Vereinigte Staaten
Zusammenfassung:
Our contributed papers and invited talks are focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration. These 3 technologies will play a major role in tomorrow’s industry as they enable application-tailored and Energy / Cost efficient circuit designs.
Eintrags-ID:
1044574
7
IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
21. Okt 2018 - 23. Okt 2018 • Washington, DC, Vereinigte Staaten
Zusammenfassung:
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
Eintrags-ID:
1045010
8
ITC — 2018 IEEE International Test Conference
30. Okt 2018 - 03. Nov 2018 • Phoenix, AZ, Vereinigte Staaten
Zusammenfassung:
International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification and validation, test (DFT, ATPG, and BIST), diagnosis, failure analysis and back to process, yield, reliability and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
Eintrags-ID:
874212
9
WiPDA — 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications
31. Okt 2018 - 02. Nov 2018 • Atlanta, GA, Vereinigte Staaten
Zusammenfassung:
The Workshop on Wide Bandgap Power Devices and Applications (WiPDA) provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, development experience, and application knowledge.
Eintrags-ID:
1044759
10
WiSEE — 2018 6th IEEE International Conference on Wireless for Space and Extreme Environments
11. Dez 2018 - 13. Dez 2018 • Huntsville, AL, Vereinigte Staaten
Zusammenfassung:
This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments.
Eintrags-ID:
983216
Verwandte Fachgebiete:
11
RWS — 2019 IEEE Radio and Wireless Symposium
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
This is a conference with a focus on wireless components, applications, and systems that impact both our current and future life style. The conference's main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today's design compromises can trigger tomorrow's advanced technologies. Where dreams can become a reality. RWS is the cornerstone conference for Radio Wireless Week.
Eintrags-ID:
934319
12
PAWR — 2019 IEEE Topical Conference on RF/Microwave Power Amplifiers for Radio and Wireless Applications
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
Topics in RF/microwave power amplifiers
Eintrags-ID:
934274
13
SiRF — 2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
20. Jan 2019 - 23. Jan 2019 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.
Eintrags-ID:
934305
14
2019 Conference on Electronic Materials and Applications
23. Jan 2019 - 25. Jan 2019 • Orlando, Vereinigte Staaten
Zusammenfassung:
The 2019 Conference on Electronic Materials and Applications is an international conference focused on fundamental properties and processing of ceramic and electroceramic materials and their applications in electronic, electro/mechanical, magnetic, dielectric, and optical components, devices, and systems.
Eintrags-ID:
1123133
Verwandte Fachgebiete:
15
ISSCC — 2019 IEEE International Solid- State Circuits Conference
02. Feb 2019 - 06. Feb 2019 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
Eintrags-ID:
573480
16
ISSCC 2019 — 2019 International Solid-State Circuits Conference
17. Feb 2019 - 21. Feb 2019 • San Francisco , Vereinigte Staaten
Zusammenfassung:
The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts
Eintrags-ID:
1123020
Verwandte Fachgebiete:
17
Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2019
24. Feb 2019 - 28. Feb 2019 • San Jose, Kalifornien, Vereinigte Staaten
Zusammenfassung:
The Novel Patterning conference showcases novel lithography and patterning techniques that provide solutions for semiconductor IC nodes, wafer-level packaging, and non-IC related technologies such as MEMS/NEMS, MOEMS, displays, photonics, metamaterials, and micro/nanofluidics, including roll-to-roll, 3D printing, and additive manufacturing.
Eintrags-ID:
1123187
18
APEC 2019 — 2019 Applied Power Electronics Conference and Exposition
17. Mär 2019 - 21. Mär 2019 • Anaheim, CA, Vereinigte Staaten
Zusammenfassung:
APEC 2019 continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronic engineer through the presentation of technical content.
Eintrags-ID:
1107228
Verwandte Fachgebiete:
19
FCMN — International Conference on Frontiers of Characterization and Metrology for Nanoelectronics
02. Apr 2019 - 04. Apr 2019 • Monterey, Kalifornien, Vereinigte Staaten
Zusammenfassung:
The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in-situ, and real-time control and monitoring. The conference will summarize major issues and provided critical reviews of important semiconductor techniques needed as the semiconductor industry moves to silicon nanoelectronics and beyond.
Eintrags-ID:
1123148
20
CS MANTECH — 2019 International Conference on Compound Semiconductor Manufacturing Technology
29. Apr 2019 - 02. Mai 2019 • Minneapolis, Vereinigte Staaten
Eintrags-ID:
1123167
21
ASMC 2019 — Advanced Semiconductor Manufacturing Conference
06. Mai 2019 - 09. Mai 2019 • Saratoga Springs, New York, Vereinigte Staaten
Zusammenfassung:
ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results.
Eintrags-ID:
1123077
22
DAC — 56th 2019 ACM/EDAC/IEEE Design Automation Conference
02. Jun 2019 - 06. Jun 2019 • Las Vegas, NV, Vereinigte Staaten
Zusammenfassung:
EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.
Eintrags-ID:
856564
23
ICNS-13 — 13th International Conference on Nitride Semiconductors 2019
07. Jul 2019 - 12. Jul 2019 • Bellevue, Washington, Vereinigte Staaten
Zusammenfassung:
The conference will present high-impact scientific and technological advances in materials and devices based on group-III nitride semiconductors, and will feature plenary sessions, parallel topical sessions, poster sessions and an industrial exhibition. The 13th International Conference on Nitride Semiconductors (ICNS-13) will feature a combination of invited and contributed talks, poster sessions and tutorials showcasing recent scientific results in a wide range of neutron science fields. The ICNS Exhibit offers the most direct access to researchers from around the world who are seeking technical solutions to their challenges. If you are involved in the nitride semiconductor community, then you need to be part of this conference.
Eintrags-ID:
1123083
24
NSREC — 2019 IEEE Nuclear and Space Radiation Effects Conference
08. Jul 2019 - 12. Jul 2019 • San Antonio, TX, Vereinigte Staaten
Zusammenfassung:
Conference offers a one day "Short Course" and 3.5 days of Tehchnical sessions consisting of 8-10 session of contributed papers. The material presented is completely related to the radiation environment and its impact on electrical components and materials
Eintrags-ID:
907045
25
ISVLSI — 2019 IEEE Computer Society Annual Symposium on VLSI
15. Jul 2019 - 17. Jul 2019 • North Miami, FL, Vereinigte Staaten
Zusammenfassung:
This Symposium explores emerging trends and novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies. Future design methodologies as well as new CAD tools to support them will also be the key topics. ISVLSI 2019 highlights a special theme of Neuromoprhic Computing. Over almost two decades the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI.
Eintrags-ID:
1004644
Verwandte Fachgebiete:
26
17th Annual International Conference on Accelerator and Large Experimental Physics Control Systems
05. Okt 2019 - 11. Okt 2019 • New York, NY, Vereinigte Staaten
Eintrags-ID:
1114469
Verwandte Fachgebiete:
27
PAST — 2019 IEEE International Symposium on Phased Array System & Technology
15. Okt 2019 - 18. Okt 2019 • Waltham, MA, Vereinigte Staaten
Zusammenfassung:
Phased array systems have made major steps forward with the development of many major radar and communications systems. Due to many recent advances, including MMIC, photonics, and digital beamforming, phased array systems and technology continue to progress rapidly. Current and future developments of ground -based, sea-based, airborne, and space -based phased array radar, communications, and other electronic systems will be discussed at this international symposium.
Eintrags-ID:
950481
28
ITC — 2019 IEEE International Test Conference
09. Nov 2019 - 15. Nov 2019 • Washington, DC, Vereinigte Staaten
Zusammenfassung:
International Test Conference, the cornerstone of TestWeek events, is the premier conference dedicated to the electronic test of devices, boards and systems – covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment designers, and test engineers
Eintrags-ID:
1004603
29
IEDM — 2019 IEEE International Electron Devices Meeting
09. Dez 2019 - 11. Dez 2019 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
Eintrags-ID:
520725
30
ISSCC — 2020 IEEE International Solid- State Circuits Conference
02. Feb 2020 - 06. Feb 2020 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
Eintrags-ID:
573567
31
ECTC — 2020 IEEE 70th Electronic Components and Technology Conference
26. Mai 2020 - 29. Mai 2020 • Orlando, FL, Vereinigte Staaten
Zusammenfassung:
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Eintrags-ID:
572815
32
DAC — 2020 57th ACM/EDAC/IEEE Design Automation Conference
01. Jun 2020 - 05. Jun 2020 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572735
33
ACC — American Control Conference
01. Jul 2020 - 03. Jul 2020 • Denver, CO, Vereinigte Staaten
Zusammenfassung:
The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).
Eintrags-ID:
1109843
34
EMCSI — 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity
27. Jul 2020 - 31. Jul 2020 • Reno, NV, Vereinigte Staaten
Zusammenfassung:
This symposium pertains to the field of electromagnetic compatibility.
Eintrags-ID:
976552
35
APEC — 2021 IEEE Applied Power Electronics Conference and Exposition
21. Mär 2021 - 25. Mär 2021 • Phoenix, AZ, Vereinigte Staaten
Eintrags-ID:
1109813
Verwandte Fachgebiete:
36
ACC — American Control Conference
26. Mai 2021 - 28. Mai 2020 • New Orleans, LA, Vereinigte Staaten
Zusammenfassung:
The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).
Eintrags-ID:
1109820
37
ECTC — 2021 IEEE 71st Electronic Components and Technologies Conference
01. Jun 2021 - 04. Jun 2021 • San Diego, Kalifornien, Vereinigte Staaten
Zusammenfassung:
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Eintrags-ID:
572792
38
DAC — 2021 58th ACM/EDAC/IEEE Design Automation Conference
07. Jun 2021 - 11. Jun 2021 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572734
39
IEDM — 2021 IEEE International Electron Devices Meeting
13. Dez 2021 - 15. Dez 2021 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
Eintrags-ID:
520757
40
DAC — 2022 59th ACM/EDAC/IEEE Design Automation Conference
06. Jun 2022 - 10. Jun 2022 • San Francisco, CA, Vereinigte Staaten
Zusammenfassung:
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
Eintrags-ID:
572777

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